Coil electronic component and method of manufacturing the same
US11069469B2 · kind B2 · utility
0Cited by
3References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2019 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Aug 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F2017/048
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A coil electronic component includes a magnetic body, wherein the magnetic body includes a substrate, and a coil part including patterned insulating films disposed on the substrate, a first plating layer formed between the patterned insulating films by plating, and a second plating layer disposed on the first plating layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.