Thin film capacitor
US11069483B2 · kind B2 · utility
1Cited by
0References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 25, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Oct 10, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1254
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thin film capacitor includes a first electrode layer (10), a dielectric layer (20) stacked on the first electrode layer (10), and a second electrode layer (30) stacked on the dielectric layer (20), wherein the dielectric layer (20) includes a layered void aggregation region (22) which extends in a direction orthogonal to a stacking direction.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.