Patent · US Active

Semiconductor module, electronic component and method of manufacturing a semiconductor module

US11069639B2 · kind B2 · utility

0Cited by

0References

12Claims

0Family size

Assignee

Infineon Technologies Austria AG · AT

Inventors

Thomas Feil · Villach, AT
Danny Clavette · Greene, US
Carsten von Koblinski · Velden am Wörther See, AT

Key dates

Filing date	Feb 22, 2019
Grant date	Jul 20, 2021
Priority date	—
Expiry date	Feb 22, 2039

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/13091
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In an embodiment, a module includes a first electronic device in a first device region and a second electronic device in a second device region. The first electronic device is operably coupled to the second electronic device to form a circuit. Side faces of the first electronic device and of the second electronic device are embedded in, and in direct contact with, a first epoxy layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.