Package for power electronics
US11069640B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2019 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Jun 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30101
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.