Method of producing an optoelectronic semiconductor component, and optoelectronic semiconductor component

US11069663B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Andreas Plößl · Regensburg, DE
• Siegfried Herrmann · Neukirchen, DE
• Martin Rudolf Behringer · Regensburg, DE
• Frank Singer · Regenstauf, DE
• Thomas Schwarz · Rhede, DE
• Alexander F. Pfeuffer · Regensburg, DE

Key dates

• Filing date: Jan 12, 2018
• Grant date: Jul 20, 2021
• Expiry date: Apr 14, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A method of producing an optoelectronic semiconductor component includes A) providing at least three source substrates, wherein each of the source substrates is equipped with a specific type of radiation-emitting semiconductor chips, B) providing a target substrate having a mounting plane configured to mount the semiconductor chips thereto, C) forming platforms on the target substrate, and D) transferring at least some of the semiconductor chips with a wafer-to-wafer process from the source substrates onto the target substrate so that the semiconductor chips transferred to the target substrate maintain their relative position with respect to one another, within the types of semiconductor chips, wherein on the target substrate the semiconductor chips of each type of semiconductor chips have a specific height above the mounting plane due to the platforms so that the semiconductor chips of different types of semiconductor chips have different heights.