Semiconductor device, method of manufacturing semiconductor device, inverter circuit, driving device, vehicle, and elevator
US11069803B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 21, 2020 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Feb 21, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D62/127
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device according to an embodiment includes: a SiC layer having a first plane, a second plane, a first trench located on a first plane side, an n-type first SiC region, a p-type second SiC region between the first SiC region and the first plane, an n-type third SiC region between the second SiC region and the first plane, and a p-type fourth SiC region between the first SiC region and the first plane, at least a portion of the fourth SiC region located in the second SiC region, the fourth SiC region having a higher p-type impurity concentration than the second SiC region; a gate electrode in the first trench; a first electrode located on the first plane side; and a second electrode located on a second plane side. A depth of the fourth SiC region increases with distance from the first trench.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.