Patent · US Active

Optoelectronic semiconductor chip and method of manufacturing the same

US11069835B2 · kind B2 · utility

0Cited by

1References

16Claims

0Family size

Assignee

Osram OLED GMBH · DE

Inventors

Adrian Stefan Avramescu · Regensburg, DE
Tansen Varghese · Regensburg, DE
Martin Straβburg · Donaustauf, DE
Hans-Jürgen Lugauer · Sinzing, DE
Sönke Fündling · Braunschweig, DE
Jana Hartmann · Wolfsburg, DE
Frederik Steib · Wolfsburg, DE
Andreas Waag · Würzburg, DE

Key dates

Filing date	Mar 16, 2018
Grant date	Jul 20, 2021
Priority date	—
Expiry date	Mar 16, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/824
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An optoelectronic semiconductor chip and a method for manufacturing a semiconductor chip are disclosed. In an embodiment an optoelectronic semiconductor chip includes a plurality of fins and a current expansion layer for common contacting of at least some of the fins, wherein each fin includes two side surfaces arranged opposite one another and an active region arranged on each of the side surfaces, wherein the plurality of fins include inner fins and outer fins having an adjacent fin only on one side, and wherein the current expansion layer is in direct contact with the inner fins on their outside.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.