Multiple layer printed circuit board that includes multiple antennas and supports satellite communications
US11069985B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2020 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Apr 4, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01Q3/36
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
Apparatuses, methods, and systems for a printed circuit board that includes multiple antennas, and operates to support satellite communications, are disclosed. One apparatus includes a first flat panel element. The first flat panel element includes a multilayer PCB (printed circuit board). The multilayer PCB includes a first exterior layer comprising N antenna elements, and a second exterior layer comprising N RF (radio frequency) chains operative to process the RF signals, each of the N RF chains electrically connected to a one of the N antenna elements, wherein all of a plurality of plated through hole vias of the PCB extend through the multilayer PCB from the first exterior layer to the second exterior layer, wherein vias that operate to connect control signals include extended cleanouts on layers of the multilayer PCB that do not include terminations of the control signals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.