Silver-bonded quartz crystal
US11070190B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Oct 5, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2003/0414
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
The disclosed technology generally relates to packaging a quartz crystal, and more particularly to bonding a quartz crystal using sintering silver paste. In one aspect, a method of packaging a quartz crystal comprises attaching a quartz crystal to a package substrate using one or more silver paste layers comprising silver particles. The method additionally comprises sintering the silver paste in a substantially oxygen-free atmosphere and at a sintering temperature sufficient to cause sintering of the silver particles. The sintering is such that the quartz crystal exhibits a positive drift in resonance frequency of the quartz crystal over time. The method further comprises hermetically sealing the quartz crystal in the package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.