Segmented focal plane array architecture

US11070747B2 · kind B2 · utility

Assignee

• FLIR Systems, Inc. · US

Inventors

• Brian B. Simolon · Lompoc, US
• Eric A. Kurth · Lompoc, US
• Mark Nussmeier · Goleta, US
• Nicholas Högasten · Lompoc, US
• Theodore R. Hoelter · Goleta, US
• Katrin Strandemar · Rimbo, SE
• Pierre Boulanger · Goleta, US
• Barbara Sharp · Lompoc, US

Key dates

• Filing date: Mar 12, 2018
• Grant date: Jul 20, 2021
• Expiry date: Mar 12, 2038

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10F39/809
• WIPO field: Audio-visual technology
• WIPO sector: Electrical engineering

Abstract

Various techniques are provided for implementing a segmented focal plane array (FPA) of infrared sensors. In one example, a system includes a segmented FPA. The segmented FPA includes a top die having an array of infrared sensors (e.g., bolometers). The top die may also include a portion of a read-out integrated circuit (ROIC). The segmented FPA also includes a bottom die having at least a portion of the ROIC. The top and the bottom dies are electrically coupled via inter-die connections. Advantageously, the segmented FPA may be fabricated with a higher yield and a smaller footprint compared with conventional FPA architectures. Moreover, the segmented FPA may be fabricated using different semiconductor processes for each die.