Optical printed circuit board and its fabrication method
US11071199B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2018 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Dec 18, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10121
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical printed circuit board and its fabrication method. The optical printed circuit board includes an electrical conductor arranged for conducting electric signal, an optical waveguide arranged for transmitting optical signal, and an optical waveguide coupling interface arranged at an end of the optical waveguide. The optical waveguide coupling interface is arranged for engagement with an external optical device to optically couple the external optical device with the optical waveguide. The optical waveguide coupling interface includes a first engagement mechanism with a socket defining a space for receiving with a corresponding plug on the external optical device or a plug arranged to be received in a corresponding socket on the external optical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.