Electronic system and processor substrate having an embedded power device module
US11071206B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 17, 2019 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Oct 17, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1316
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A processor substrate includes: an electrically insulating material having a first main side and a second main side opposite the first main side; a plurality of electrically conductive structures embedded in the electrically insulating material and configured to provide an electrical interface for a processor at the first main side of the electrically insulating material and to provide electrical connections from the electrical interface to the second main side of the electrically insulating material; and a power device module embedded in the electrically insulating material and configured to convert a voltage provided at the second main side of the electrically insulating material and which exceeds a voltage limit of the processor substrate to a voltage that is within an operating range of the processor and below the voltage limit of the processor substrate. An electronic system that includes the processor substrate is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.