Anisotropic etching using highly branched polymers
US11071210B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Jan 14, 2019 |
| Grant date | Jul 20, 2021 |
| Priority date | — |
| Expiry date | Jan 14, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/125
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An etching composition for etching an electrically conductive layer structure for forming a conductor track is provided. The etching composition includes an etchant, a highly branched compound and optionally a solvent. In addition, a method of etching an electrically conductive layer structure, a conductor track, an arrangement of at least two conductor tracks, and a component carrier are provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.