Removable 3D build module comprising a memory
US11072027B2 · kind B2 · utility
4Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 20, 2015 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Dec 22, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A removable build module to connect to a host apparatus, may include a build platform to support an object-to-be-built, a drive unit to move the build platform, a memory to receive and store build parameters, and an interface circuit to communicate the build parameters to the host apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.