Method for producing a technical mask
US11072041B2 · kind B2 · utility
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0References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 5, 2018 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Mar 5, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for producing a technical mask includes: providing a technical mask including at least one plate-shaped substrate, the plate-shaped substrate being transparent to at least one laser wavelength; and producing at least one opening in the mask by laser-induced deep etching. In an embodiment, an etching attack takes place at least temporarily on one side during laser-induced deep etching.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.