Fine silver particle dispersion
US11072715B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 4, 2019 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Jul 3, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/003
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
This disclosure relates to a conductive paste comprising a fine silver particle dispersion and a glass frit, wherein the fine silver particle dispersion comprising: (1) 65 to 95.4% by weight of fine silver particles which have average primary particle diameter of 10 to 190 nm and which comprise 25% by number or less of silver particles having primary particle diameter of 100 nm or larger, (2) 4.5 to 34.5% by weight of a solvent, (3) 0.1 to 1.0% by weight of ethyl cellulose having weight average molecular weight of 10,000 to 120,000. Also provided are: a method of manufacturing an electrically conductive thick film comprising steps of: (a) applying said fine silver particle dispersion on a substrate, and (b) heating the applied fine silver particle dispersion at 80 to 1000° C.; and an electrical device comprising a conductive thick film made with the foregoing paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.