Manufacturing method for shear and normal force sensor
US11073434B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 4, 2019 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Dec 4, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/875
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Provided are a method of manufacturing a shear and normal force sensor including fabricating raised and sunken polymers having a plurality of bent parts of bent shapes, forming an electrode pattern on one surface of a piezoelectric element, and embedding the piezoelectric element between the raised and sunken polymers, and a shear and normal force sensor including raised and sunken polymers having a plurality of bent parts of bent shapes, a piezoelectric element embedded between the raised and sunken polymers and having an electrode pattern on one surface, and a flexible printed circuit board (FPCB) embedded between the sunken polymer and the piezoelectric element and electrically connected to the electrode pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.