Infrared cut-off filter and preparation method thereof
US11073639B2 · kind B2 · utility
1Cited by
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16Claims
0Family size
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Key dates
| Filing date | Dec 15, 2017 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Dec 22, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03B11/00
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
The application relates to an infrared cut-off filter, which includes: a substrate composed of white glass and an infrared cut-off film layer plated on one surface of the white glass; a spin-coated layer plated on the other surface of the white glass; and a reflection-reducing film layer plated on the spin-coated layer; the spin-coated layer includes a bottom layer and an absorbing layer each composed of an organic substance. The infrared cut-off filter has a stable structure, a high degree of firmness between layers, and a low cost.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.