Electronic device interconnect
US11073873B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 25, 2020 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Mar 25, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/181
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device may include a substrate having a substrate body. The electronic device may include a first interconnect region, for example located proximate to a first end of the substrate. The first interconnect region may extend from the substrate body. The first interconnect region may include a first set of interconnects, and the first set of interconnects may be located proximate to the substrate body. The first interconnect region may include a second set of interconnects, and the second set of interconnects may be located remote from the substrate body. The second set of interconnects may be physically separated from the first set of interconnects, for example by an inactive region. The first set of interconnects may be located between the inactive region and the substrate body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.