Blockchain based loan securitization
US11074648B1 · kind B1 · utility
92Cited by
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16Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 9, 2018 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | May 15, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04L2209/805
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Examples described herein relate to systems, apparatuses, and methods for automating loan securitization by a loan marketplace server, including defining a security blockchain supporting a financial security smart contract and posting, on the security blockchain, loan links. Each of the loan links identifies a loan structured as a loan smart contract supported by a loan blockchain. The loan blockchain stores a financial profile link that identifies a dynamic financial profile for a borrower of the loan.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.