Patent · US Active

Si-passivated GE gate stack

US11075083B2 · kind B2 · utility

0Cited by
6References
20Claims
0Family size

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Inventors

Key dates

Filing dateNov 22, 2019
Grant dateJul 27, 2021
Priority date
Expiry dateNov 22, 2039

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH10D64/685
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A method for forming a gate stack of a field-effect transistor includes depositing a Si capping layer on a Ge channel material (100). The method further includes depositing an oxide layer on the Si capping layer by a plasma enhanced deposition technique at a temperature less than or equal to 200° C., and a plasma power less than or equal to 100 W.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.