Si-passivated GE gate stack
US11075083B2 · kind B2 · utility
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6References
20Claims
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Key dates
| Filing date | Nov 22, 2019 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Nov 22, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/685
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for forming a gate stack of a field-effect transistor includes depositing a Si capping layer on a Ge channel material (100). The method further includes depositing an oxide layer on the Si capping layer by a plasma enhanced deposition technique at a temperature less than or equal to 200° C., and a plasma power less than or equal to 100 W.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.