Modules incorporating encapsulation layers
US11075128B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 3, 2019 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Oct 3, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Aspects of the present disclosure include a packaged product including a product, a first encapsulation disposed on top of the product, wherein the first encapsulation is configured to protect the product during an operation of the product, a second encapsulation disposed on top of the first encapsulation, wherein the second encapsulation is configured to protect the product during a testing of the product, and a third encapsulation disposed on top of the second encapsulation, wherein the third encapsulation is configured to protect the product during a transport of the product, wherein at least one of the first encapsulation, the second encapsulation, or the third encapsulation is detachably coupled with the product.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.