Heat conduction structure or semiconductor apparatus
US11075140B2 · kind B2 · utility
0Cited by
2References
9Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Jun 24, 2019 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Jun 24, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The disclosure provides a heat conduction structure with higher heat conductivity. This embodiment is a heat conduction structure where heat is conducted from a first member to a second member. The heat conduction structure includes at least one self-assembled monolayer and a heat dissipation grease. The self-assembled monolayer is formed on at least one surface of the first member and the second member. The heat dissipation grease is disposed between the first member and the second member. The heat dissipation grease is in contact with the self-assembled monolayer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.