Module base with integrated thermal spreader and heat sink for thermal and structural management of high-performance integrated circuits or other devices
US11075141B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 12, 2019 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Dec 11, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L23/473
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus includes a module base configured to carry one or more devices to be cooled. The module base includes a cover and a heat sink connected to the cover. The cover includes first and second encapsulation layers and a thermal spreader between the encapsulation layers. The first encapsulation layer is configured to receive thermal energy from the device(s). The thermal spreader is configured to spread out at least some of the thermal energy and to provide the spread-out thermal energy to the second encapsulation layer. The heat sink is configured to receive the thermal energy through the second encapsulation layer and to transfer the thermal energy out of the module base. The first encapsulation layer includes multiple openings. The module base includes multiple tabs inserted through the openings. Each tab is configured to provide a thermal interface between at least one of the device(s) and the thermal spreader through the first encapsulation layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.