Semiconductor device and method of manufacturing the semiconductor device
US11075180B2 · kind B2 · utility
0Cited by
2References
15Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 4, 2017 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Dec 21, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/13147
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor element having a plated portion on a part of a main surface and a protective member that seals surfaces of the semiconductor element except for the main surface, wherein the plated portion is electrically connected to a circuit in the semiconductor element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.