Electroplating of niobium titanium
US11075435B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 25, 2018 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Jan 25, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B13/016
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The subject disclosure relates to electroplating niobium titanium (Nb/Ti) with a metal capable of being soldered to. According to an embodiment, a structure is provided that comprises a Nb/Ti substrate and a metal layer plated on a portion of the Nb/Ti substrate. The metal layer comprises an electroplated metal layer plated on the portion of the Nb/Ti substrate using electroplating. The metal layer can comprise a metal capable of being soldered to, such as copper. In another embodiment, a cable assembly is provided that comprises a niobium titanium wire, a metal layer plated on a first portion of the niobium titanium wire, and a metal coaxial connector soldered to the metal layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.