Arrangement for dissipating heat of a power supply unit in a housing
US11076504B2 · kind B2 · utility
1Cited by
10References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2020 |
| Grant date | Jul 27, 2021 |
| Priority date | — |
| Expiry date | Mar 6, 2040 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E60/10
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present disclosure envisages an arrangement (100) for dissipating heat of a power supply unit (105) in a housing (110). The arrangement (100) comprises at least one packing member (120). The packing member (120) is disposed between the power supply unit (105) and an operative inner wall of the housing (110) to increase conductive thermal contact between inner walls of the housing (110) and the power supply unit (105). The arrangement (100) facilitates maximum surface contact between a power supply unit and inner walls of a housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.