Laser processing head and laser processing system including the same
US11077520B1 · kind B1 · utility
2Cited by
1References
20Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 7, 2020 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | May 7, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/702
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser processing head includes a housing including a mounting surface for mounting the laser processing head on a carrier; a plurality of optical components arranged within the housing; and an access opening formed in the housing for removing or inserting at least one first optical component among the optical components, the access opening being formed in the mounting surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.