Laser processing apparatus, methods of laser-processing workpieces and related arrangements
US11077526B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 8, 2016 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Jan 19, 2038 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/54
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Apparatus and techniques for laser-processing workpieces can be improved, and new functionalities can be provided. Some embodiments discussed relate to processing of workpieces in a manner resulting in enhanced accuracy, throughput, etc. Other embodiments relate to realtime Z-height measurement and, when suitable, compensation for certain Z-height deviations. Still other embodiments relate to modulation of scan patterns, beam characteristics, etc., to facilitate feature formation, avoid undesirable heat accumulation, or otherwise enhance processing throughput. A great number of other embodiments and arrangements are also detailed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.