Mold assembly and method of molding a component
US11077590B2 · kind B2 · utility
0Cited by
1References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2019 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Jan 16, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/005
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold assembly includes a first upper portion, a second upper portion, and a base removably coupled to each other. A method of manufacturing an electrical connector with the mold assembly includes preheating a resin, mixing the resin with a hardener, preheating the mold assembly, injecting the resin hardener mixture into the mold assembly, and curing the resin hardener mixture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.