Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US11078112B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 14, 2018 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | May 14, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24273
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Silica-containing substrates including vias with a narrow waist, electronic devices incorporating a silica-containing substrate, and methods of forming vias with narrow waist in silica-containing substrates are disclosed. In one embodiment, an article includes a silica-containing substrate including greater than or equal to 85 mol % silica, a first surface, a second surface opposite the first surface, and a via extending through the silica-containing substrate from the first surface toward the second surface. The via includes a first diameter at the first surface wherein the first diameter is less than or equal to 100 μm, a second diameter at the second surface wherein the first diameter is less than or equal to 100 μm, and a via waist between the first surface and the second surface. The via waist has a waist diameter that is less than the first diameter and the second diameter such that a ratio between the waist diameter and each of the first diameter and the second diameter is less than or equal to 75%.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.