Patent · US Active

Polyamide composition containing a polyamide and an additive

US11078362B2 · kind B2 · utility

0Cited by

12References

9Claims

0Family size

Assignee

BASF SE

Inventors

Claus Gabriel · Ludwigshafen am Rhein, DE
Simon Gramlich · Ludwigshafen am Rhein, DE
Rainer Ostermann · Recklinghausen, DE
Florian Richter · Mannheim, DE
Raphael Dabbous · Riehen, CH
Thomas Meier · Cherbourg, FR
Wolfgang Schrof · Neuleiningen, DE

Key dates

Filing date	Feb 16, 2017
Grant date	Aug 3, 2021
Priority date	—
Expiry date	Feb 16, 2037

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC09B67/0097
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

The present invention relates to a polyamide composition (PC) which comprises at least one polyamide (P) and at least one additive (A). The present invention further relates to the use of the polyamide composition (PC) in a selective laser sintering process, in an injection molding process, for producing molded articles and in an extrusion process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.