Additive for quality determination of adhesive bond primers
US11078386B2 · kind B2 · utility
0Cited by
4References
17Claims
0Family size
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Key dates
| Filing date | Oct 5, 2018 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Apr 26, 2039 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/408
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A method of adhering a first component to a second component includes priming the first component with an adhesive bond primer containing a primer material, a corrosion inhibitor, and a chemical additive (such as a dye compound), and using an adhesive to attach the second component to the first component through the adhesive bond primer applied on the surface of the second component. The chemical additive allows inspection of the adhesive bond primer with a corresponding radiation source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.