Tin-plated product and method for producing same
US11078587B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 23, 2016 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | May 22, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R43/16
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A tin-plated product contains: a substrate 10 of copper or a copper alloy; an underlying layer 12 of nickel which is formed on the surface of the substrate 10; and an outermost layer 14 containing tin, the outermost layer 14 being formed on the surface of the underlying layer 12, the outermost layer 14 being composed of a copper-tin alloy layer 14a of a large number of crystal grains of a copper-tin alloy, tin layers 14b of tin having an average thickness of 0.01 to 0.20 micrometers, and a plurality of copper-nickel-tin alloy layers 14c of a copper-nickel-tin alloy, each of the tin layers 14b being formed in a corresponding one of recessed portions between adjacent two of the crystal grains of the copper-tin alloy on the outermost surface of the copper-tin alloy layer, the copper-nickel-tin alloy layers 14c being arranged on the side of the underlying layer 12 in the copper-tin alloy layer 14a so as to be apart from each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.