Radiative cooling substrate and manufacturing method of the same
US11078593B2 · kind B2 · utility
3Cited by
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6Claims
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Key dates
| Filing date | Feb 22, 2019 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Apr 24, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF28F2245/06
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A radiative cooling substrate and a manufacturing method of the radiative cooling substrate are provided. The radiative cooling substrate includes a metallic substrate and a chitosan layer disposed on the metallic substrate with a thickness of 0.5 μm to 10 μm. The chitosan layer emits radiation within a waveband between 8 μm and 13 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.