System and method for vapor chamber directional heat dissipation for a piezoelectric keyboard assembly
US11079816B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 31, 2020 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Jan 31, 2040 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2217/96015
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An integrated heat dissipation system for a haptic piezoelectric keyboard of an information handling system comprising a base chassis formed of a C-cover affixed to a D-cover to house the haptic piezoelectric keyboard assembly, a processor, and a heat dissipating layer and the heat dissipating layer thermally coupled to a haptic piezoelectric keyboard assembly and the processor to direct heat away from the keys of the piezoelectric keyboard of the C-cover and toward a vertical edge of the base chassis, where the piezoelectric keyboard assembly comprises a plurality of piezoelectric sensors disposed across a support plate, and a contact foil layer, for detecting deformation of one of the plurality of piezoelectric sensors and registering a keystroke, affixed to the plurality of piezoelectric sensors and the support plate and provide a haptic feedback control signal to generate a haptic response to the keys of the piezoelectric keyboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.