Multi-die-package and method
US11081430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2018 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Nov 16, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02B70/10
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A package and a corresponding method are described. The method includes: providing a processed first wafer having front and back sides and including power semiconductor dies implemented within the wafer by processing its front side, each die having a first load terminal at the front side and a second load terminal at the back side; providing an unprocessed second wafer made of an electrically insulating material and having first and second opposing sides; forming a plurality of recesses within the second wafer; filling the plurality of recesses with a conductive material; forming a stack by attaching, prior or subsequent to filling the recesses, the second wafer to the front side of the first wafer, the conductive material electrically contacting the first load terminals of the power semiconductor dies; and ensuring that the conductive material provides an electrical connection between the first side and the second side of the second wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.