Radiation shield around a component on a substrate
US11081450B2 · kind B2 · utility
1Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2019 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Sep 27, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16153
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, a radiation source on the substrate, a ground on the substrate, where the ground is located around the radiation source, and a heat spreader over the radiation source, where the heat spreader includes one or more ground coupling mechanisms that are in contact with the ground on the substrate. The one or more ground coupling mechanisms in contact with the ground on the substrate create a radiation shield that at least partially keeps radiation from the radiation source from extending past the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.