Method for joining a micorelectronic chip to a wire element
US11081466B2 · kind B2 · utility
0Cited by
5References
20Claims
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Assignee
Inventors
Key dates
| Filing date | Apr 16, 2018 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | May 22, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8592
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for joining a microelectronic chip to at least one wire element comprises a first step of applying a cover to a first face of the microelectronic chip, the cover being configured to form, with the first face, at least one temporary side groove. The method additionally comprises a step of inserting the wire element into the temporary groove. The method further comprises a step of attaching the wire element to the microelectronic chip. The method additionally comprises a step of removing the cover from the microelectronic chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.