Patent · US Active

Asymmetrically shaped light-emitting device, backlight module using the same, and method for manufacturing the same

US11081631B2 · kind B2 · utility

0Cited by

7References

23Claims

0Family size

Assignee

MAVEN OPTRONICS CO., LTD. · TW

Inventors

Chieh Chen · Palo Alto, US
Chia-Hsien Chang · 埔鹽鄉, TW

Key dates

Filing date	Jul 6, 2020
Grant date	Aug 3, 2021
Priority date	—
Expiry date	Jul 6, 2040

Classification

Technology area (CPC H)Electricity
CPC primaryH10H20/853
WIPO fieldOptics
WIPO sectorInstruments

Abstract

An asymmetrically shaped chip-scale packaging (CSP) light-emitting device (LED) includes an LED chip, a photoluminescent structure (or a light-transmitting structure), and a reflective structure. The photoluminescent structure covers the upper surface and/or the edge surface of the LED chip; and the reflective structure at least partially covers the edge surface of the photoluminescent structure. The reflective structure partially reflects the primary light emitted from the edge surface of the LED chip or the converted secondary light radiated from the edge surface of the photoluminescent structure, therefore shaping the radiation pattern asymmetrically.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.