Bottom ported MEMS microphone with additional port for verification of environmental seal
US11082774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2019 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Dec 23, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2201/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Methods and systems for verification of an environmental seal provided by an encapsulant coating of a bottom-ported MEMS microphone package. A purposeful acoustic leak is provided on an upper surface of a package housing (in the form of an additional acoustic port) and a sealing material is applied to an outer surface of the package housing. A properly applied encapsulant coating will completely seal the additional acoustic port on the upper surface of the package housing. However, the placement of the additional acoustic port on the upper surface of the package housing will have a significant, detectable effect on the frequency response of the microphone if it is not completely sealed by the encapsulant coating. Accordingly, the environmental seal provided by the encapsulant coating is verified by confirming, based on the acoustic frequency response testing, that the encapsulant coating has effectively sealed the additional acoustic port on the upper surface of the package housing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.