Micro power distribution boxes and methods of manufacturing same using application specific electronics packaging techniques
US11083088B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 5, 2017 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Dec 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1327
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro power distribution box is provided which includes a device, a connector/housing and a cover. The device has a substrate, at least one first finger, at least one second finger, and at least one electrical component. The at least one first finger and the at least one second finger are electrically connected to one another. The at least one first finger has first, second and third portions. The at least one second finger has first and second portions. The substrate is overmolded to the first portions of the at least one first and second fingers. The substrate is not overmolded to the second portions of the at least one first and second fingers or to the third portion of the at least one first finger. The second portions of the at least one first and second fingers extend outwardly from the substrate. The second portion of the at least one first finger is a high current contact. The second portion of the at least one second finger is a contact pin. The third portion of the at least one first finger is exposed via an aperture provided through the substrate. The at least one electrical component is directly mounted to the third portion of the at least one first finger in order to…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.