Outdoor electronics enclosure with modular structure
US11083093B2 · kind B2 · utility
1Cited by
3References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2019 |
| Grant date | Aug 3, 2021 |
| Priority date | — |
| Expiry date | Jun 3, 2039 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1488
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A modular electronics enclosure includes a rear frame, a first L-shaped piece and a second L-shaped piece joined to form a box-shaped shell having a floor, a ceiling, a rear wall and first and second opposed side walls that define an internal cavity. The first L-shaped piece includes a wall panel and a top panel that form the ceiling and the first side wall of the shell. The second L-shaped piece includes a wall panel and a bottom panel that form the floor and the second side wall of the shell. The rear frame forms the rear wall of the shell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.