Laser-etching and machine-vision positioning system
US11084123B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2019 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Feb 28, 2040 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K26/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems, methods and computer program products for laser etching and robotic machining of large workpieces are disclosed. An example system includes a first ring of lasers configured to etch longitudinal gridlines on a workpiece, a second ring of lasers configured to etch circumferential gridlines on the workpiece, where the longitudinal gridlines and the circumferential gridlines define a working grid on the workpiece, and a machine vision system to scan the working grid and compare the working grid to a reference grid in a computer model of the workpiece and to determine offsets between the working grid and the reference grid for positioning a robotic machining tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.