Laser lift off method and laser lift off system
US11084127B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 12, 2018 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Aug 19, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/549
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser lift-off method is disclosed. The laser lift-off method includes: controlling a laser beam to penetrate a substrate along a first irradiation direction, so as to scan an interface between a material layer and the substrate stacked on each other, wherein there is at least one particle on a side of the substrate away from the material layer, and a region of the interface not irradiated by the laser beam along the first irradiation direction is an occluded region; controlling another laser beam to penetrate the substrate along a second irradiation direction, so as to scan the interface between the material layer and the substrate, so that at least a part of the occluded region is irradiated by the another laser beam along the second irradiation direction; and separating the material layer from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.