Diode laser fiber array for contour of powder bed fabrication or repair
US11084132B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2017 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Aug 9, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P10/25
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of forming a build in a powder bed includes providing a first diode laser fiber array and a second diode laser fiber array, emitting a plurality of laser beams from selected fibers of the second diode laser fiber array onto the powder bed, corresponding to a pattern of a layer of the build, simultaneously melting powder in the powder bed corresponding to the pattern of the layer of the build, scanning a first diode laser fiber array along an outer boundary of the powder bed and emitting a plurality of laser beams from selected fibers of the first diode laser fiber array and simultaneously melting powder in the powder bed corresponding to the outer boundary of the layer of the build to contour the layer of the build. An apparatus for forming a build in a powder bed including a first diode laser fiber array and a second diode laser fiber array is also disclosed. The first diode laser fiber array configured to contour the layer of the build.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.