Bonded nutplate rapid cure system
US11084230B1 · kind B1 · utility
0Cited by
1References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2018 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Aug 16, 2039 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF16B37/14
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Embodiments of systems and methods for positioning and bonding a nutplate to a substrate comprising at least one aperture, wherein the system includes a nutplate engagement fixture formed from a rigid tube and an elastomeric tube, a heater operable to deliver heat to a bonding surface of the nutplate, at least one temperature sensor operable to measure the temperature of the bonding surface of the nutplate, a temperature sensor retention fixture operable to position and secure the at least one temperature sensor to the nutplate, and a heater controller operable to control the output from the heater.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.