Stress reduction during laser resealing through a temperature increase

US11084716B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Julia Amthor · Reutlingen, DE
• Mawuli Ametowobla · Stuttgart, DE
• Philip Kappe · Stuttgart, DE

Key dates

• Filing date: Oct 12, 2016
• Grant date: Aug 10, 2021
• Expiry date: May 17, 2038

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B81C2203/019
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

A method for producing a micromechanical component having a substrate and a cap that are connected to each other and that enclose a first cavity, where a first pressure prevails inside the first cavity and a first gas mixture having a first chemical composition is enclosed within the first cavity, includes, in a first method step, developing in the substrate or cap an access opening connecting the first cavity to an environment of the micromechanical component, in a second method step, setting the first pressure and/or the first chemical composition in the first cavity, in a third method step, sealing the access opening using a laser by introduction of energy or heat into an absorbing part of the substrate or the cap, and, in a fourth method step, performing a thermal treatment of the substrate or the cap, thereby reducing temperature gradients in the substrate or in the cap.