Electrically conductive particle and manufacturing method thereof, and electrically conductive adhesive and manufacturing method thereof
US11084956B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Apr 28, 2017 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Aug 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01B13/0036
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Embodiments of the present disclosure relate to an electrically conductive particle and a manufacturing method thereof as well as an electrically conductive adhesive comprising the electrically conductive particle and a manufacturing method thereof. The electrically conductive particle comprises: a core microsphere; an electrically conductive macromolecular layer encapsulating the core microsphere; and a 3D graphene layer and a metal layer encapsulating the electrically conductive macromolecular layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.