Methods and apparatus for forming node to panel joints
US11085473B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 22, 2017 |
| Grant date | Aug 10, 2021 |
| Priority date | — |
| Expiry date | Dec 28, 2039 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T403/473
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A node to panel interface structure for use in a transport structure such as a vehicle is disclosed. In an aspect, the node includes a base, first and second sides protruding from the base to form a recess for receiving a panel, ports for adhesive injection and/or vacuum generation, one or more adhesive regions disposed on a surface of each side adjacent the panel, and at least one channel coupled between the first and second ports and configured to fill the adhesive regions with an adhesive, the adhesive being cured to form a node-panel interface. The node may be additively manufactured. In an exemplary embodiment, the node may use sealant features for including sealants that border and define the adhesive regions, and that may hermetically seal the region before and after adhesive injection. In another embodiment, the node may include isolation features for including isolators for inhibiting galvanic corrosion. In another aspect, adhesive may be filled serially on the adhesive regions on the first side and then on the adhesive regions on the second side. Adhesive may alternatively may be filled in parallel, or concurrently, on the adhesive regions of both sides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.